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S1 Series- Engineering Model

sx2400












  • Description
  • Device Type
  • Device Size
  • Index Time
  • Throughput
  • Contact Pitch
  • Contact Mode
  • Specification
  • BGA, CSP, QFN, SQFP, PGA, Bare Die
  • 3.0x3.0mm ~ 50x50mm
  • 2.5s
  • Up to 1,500
  • 40mm -> 80mm
  • 1~8ch