R4 - Tri-Temp
| Description | Specification |
|---|---|
| Device Type | BGA, CSP, QFN, BCC, SQFP, TSOP |
| Device Size | 1x1 to 100x100 mm |
| Device Thickness | 0.4 to 5.0 mm |
| Temp Range | -80 to 175°C |
| Max Contact Force | 80 kgf |
| Index Time | 9.5 secs (11.3 with Precisor) |
| UPH | 1ch: 380 (320 with Precisor) |
| Test Site | Single |
| Jam Rate | Single |
| Temperature Accuracy | -40 to +125°C ±3°C +125 to +175°C ±5°C |