S1 - Engineering Model
- Description
- Device Type
- Device size
- Device thickness
- Temp. Range
- Index time
- UPH
- Test site
- Temp accuracy
- Contact Force
- Specification
- BGA, CSP, QFN, BCC, QFP, TSOP
- 1X1~100X100 (mm)
- 0.4~5.0
( mm ) - -80 to 175 degrees
- 9.5 seconds (11.3 with Precisor)
- 1ch:380 (320 with precisor)
- Single
- ±3℃(-40 ~ +125℃),±5℃(+125 ~ +175℃)
- 80 kgf